Product
stability of the final product. Simply put, the structure of COB packaging is to directly solder the most original, exposed chips or electronic components on the circuit board and cover them with special resins.
Formal VS Flip-Chip
Advantages of Full Flip-Chip COB
Ultra-high reliability
The thickness of the packaging layer is further reduced, which can completely solve the problem of color lines and bright and dark lines between formal COB modules. The black field is darker, the brightness is brighter, and the contrast is higher. Support HDR digital image technology, static and high dynamic image quality is fine and perfect.
Simplified process, better display
As an upgraded product of the regular COB, the full flip-chip COB further improves reliability on the basis of the advantages of the regular COB's ultra-small dot pitch, high reliability, and non-glare surface light source, simplifies the production process, has better display effects, perfect near-screen experience, and can achieve true chip-level spacing.
Large size, wide field of view
2K/4K/8K resolution, unlimited size free splicing, suitable for large scene display. It has good viewing angle and side display uniformity, no color cast under a wide viewing angle, and can achieve a 170-degree viewing effect.
Ultra-high density, smaller dot pitch
The full flip-chip COB is a true chip-level package, without wire bonding, and the physical space size is only limited by the size of the light-emitting chip. It breaks through the dot pitch limit of the regular chip and is the first choice for products with a dot pitch of less than 1.0.
Energy-saving and comfortable, good near-screen experience
The full flip-chip light-emitting chip reduces power consumption by 45% under the same brightness conditions. Unique heat dissipation technology, under the same brightness, the surface temperature of the screen is 10°C lower than that of the conventional regular chip LED display, which is more suitable for application scenarios with near-screen experience.
olor lines and bright and dark lines between formal COB modules. The black field is darker, the brightness is brighter, and the contrast is higher. Support HDR digital image technology, static and high dynamic image quality is fine and perfect.
Simplified process, better display
As an upgraded product of the regular COB, the full flip-chip COB further improves reliability on the basis of the advantages of the regular COB's ultra-small dot pitch, high reliability, and non-glare surface light source, simplifies the production process, has better display effects, perfect near-screen experience, and can achieve true chip-level spacing.
Large size, wide field of view
2K/4K/8K resolution, unlimited size free splicing, suitable for large scene display. It has good viewing angle and side display uniformity, no color cast under a wide viewing angle, and can achieve a 170-degree viewing effect.
Ultra-high density, smaller dot pitch
The full flip-chip COB is a true chip-level package, without wire bonding, and the physical space size is only limited by the size of the light-emitting chip. It breaks through the dot pitch limit of the regular chip and is the first choice for products with a dot pitch of less than 1.0.
Energy-saving and comfortable, good near-screen experience
The full flip-chip light-emitting chip reduces power consumption by 45% under the same brightness conditions. Unique heat dissipation technology, under the same brightness, the surface temperature of the screen is 10°C lower than that of the conventional regular chip LED display, which is more suitable for application scenarios with near-screen experience.
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