What is a COB light source? What are its advantages?

COB light source is already a common product category in lighting products. There are many brands that produce COB light sources, but many people still don't know what COB light source means.

COB is the abbreviation of Chip on Board, which means chip packaging technology on board. It can be simply understood as: a light source in which multiple LED chips are integrated and packaged on the same substrate.

COB integrated packaging is a relatively mature LED packaging method. With the widespread application of LED products in the field of lighting, COB surface light source has become one of the mainstream products in the packaging industry.

COB light source is a high-efficiency integrated surface light source technology in which LED chips are directly attached to a mirror metal substrate with high reflectivity. This technology eliminates the concept of brackets, has no electroplating, no reflow soldering, and no patch process, so the process is reduced by nearly one-third, and the cost is also saved by one-third.

COB light source can be simply understood as a high-power integrated surface light source. The light output area and external dimensions of the light source can be designed according to the product appearance structure.

Product features:

Cheap, convenient

Electrically stable, circuit design, optical design, and heat dissipation design are scientific and reasonable;

Heat sink process technology is used to ensure that LED has an industry-leading thermal lumen maintenance rate (95%).

It is convenient for the secondary optical matching of the product and improves the lighting quality. ;

High color rendering, uniform light emission, no light spot, healthy and environmentally friendly.

Simple installation, easy to use, reduce the difficulty of lamp design, save lamp processing and subsequent maintenance costs.

Main product bare chip technology has two main forms: one is COB technology, the other is flip chip technology (Flip Chip). Chip on board packaging (COB), semiconductor chip handover mounted on the printed circuit board, the electrical connection between the chip and the substrate is achieved by wire stitching method, and covered with resin to ensure reliability.

Main applications of COB light sources

Indoor main ones are: spotlights, downlights, ceiling lights, ceiling lights, fluorescent lamps and light strips.

Outdoor ones are street lights, mining lamps, floodlights and current urban night scene wall washers, luminous characters, etc.

COB Light Source Manufacturing Process

The COB chip on board (COB) process first covers the silicon wafer placement point on the substrate surface with thermally conductive epoxy resin (generally epoxy resin doped with silver particles), then directly places the silicon wafer on the substrate surface, heat treats until the silicon wafer is firmly fixed to the substrate, and then uses wire welding to directly establish electrical connections between the silicon wafer and the substrate.

Advantages of COB:

In terms of cost, compared with discrete light source devices, COB light source modules can save device packaging costs, light engine module manufacturing costs and secondary light distribution costs in lighting applications. In lighting fixture systems with the same functions, the overall cost can be reduced by about 15%. In terms of performance, through reasonable design and molding of microlenses, COB light source modules can effectively avoid the drawbacks of discrete light source device combinations such as spotting and glare, and can also effectively improve the color rendering of the light source (currently it can reach more than 90) by adding appropriate red chip combinations without reducing the efficiency and life of the light source.

In terms of application, COB light source blocks can make the installation and production of lighting fixture factories simpler and more convenient. In production, the existing process technology and equipment can fully support the large-scale manufacturing of COB light source modules with high yield rate.

The new fourth-generation COB plane light source can also be said to be an evolution of the fourth-generation light source, because its light source is a chip light-emitting diode. But the difference between the two lies in the packaging technology. The fifth-generation light source uses the world's most cutting-edge high-tech packaging technology to encapsulate ordinary light-emitting diodes in a small plane, so it is called a surface light source. Compared with point light sources, under the same wattage, the surface light source has a maximum reduction of more than 10 times the surface light area of the point light source, so the heat generated is also reduced by 5-10 times, which greatly reduces energy consumption and light source exhaustion caused by heat dissipation problems, and makes the assembled lamp housing lighter and simpler. The luminous angle and effect of the surface light source are better exerted and applied under the refraction and focusing of the lens, so that the luminous angle can be arbitrarily adjusted, thereby forming a secondary light distribution. However, due to the large luminous area of the point light source, it is more difficult to use the lens, and the luminous angle becomes a dead angle.