Full Flip Chip COB Advantages

In today's display technology field, full flip-chip COB (Chip-on-Board) technology is gradually becoming the new favorite of the industry. Its unique advantages not only solve the many challenges faced by traditional formal COB modules, but also bring users an unprecedented visual experience.

Ultra-high reliability: The hero behind the picture quality upgrade, let us focus on the most eye-catching advantage of full flip-chip COB-ultra-high reliability. This feature comes from its innovative packaging layer design. By further reducing the thickness of the packaging layer, the common color lines and bright and dark lines in formal COB modules are completely eradicated. This means that both deep black fields and dazzling highlights can be displayed more pure and vividly. In addition to the support for R digital image technology, both static pictures and high-speed dynamic scenes can be presented with fine and perfect picture quality, bringing users immersive viewing enjoyment.

Simplified process, excellent display effect, full flip-chip COB as an innovative iterative product of formal COB, not only inherits the excellent genes of ultra-small dot pitch, high reliability and non-glare of surface light source, but also achieves a qualitative leap on these basis. The simplification of its production process directly promotes the improvement of production efficiency, while ensuring the comprehensive optimization of display effects. The near-screen experience has therefore reached a new height, achieving a true chip-level spacing, making the picture delicate and the overall look and feel even better.

Large size and wide field of view: a visual feast of unlimited possibilities. Facing the needs of large-scale display, the full flip-chip COB has achieved unlimited size free splicing with its 2K/4K/8K high-resolution capabilities, and can easily handle various large-scene display tasks. More importantly, it has excellent viewing angles and side-view display uniformity. Even when viewed at a wide viewing angle, there will be no color deviation. The wide field of view of up to 170 degrees allows the audience to enjoy consistent wonderful pictures wherever they are.

Ultra-high density, extreme breakthrough in dot pitch, and true chip-level packaging are another highlight of the full flip-chip COB. This design maximizes the use of physical space, limited only by the size of the light-emitting chip itself, thus successfully crossing the boundaries of the dot pitch of the regular chip. For products with a dot pitch below 1.0mm that pursue extremely delicate picture quality, full flip-chip COB is undoubtedly the best partner, opening up new possibilities for the high-end display market.

Energy saving and comfort, a new height of near-screen experience, it is worth mentioning that full flip-chip COB has excellent performance in energy saving and comfort. Thanks to the efficient light-emitting chip, the power consumption is reduced by an astonishing 45% at the same brightness, which not only means a significant reduction in operating costs, but also highlights the concept of green environmental protection.

At the same time, with the help of advanced heat dissipation technology, even under long-term high-intensity use, the surface temperature of the screen is still 10℃ lower than that of traditional regular chip LED display screens, which greatly improves the comfort of near-screen operation or viewing, especially suitable for application scenarios such as education, design, and e-sports that require close interaction.

Full flip-chip COB is leading a profound change in display technology with its ultra-high reliability, simplified production process, wide field of view performance, extreme dot pitch breakthrough and unremitting pursuit of energy saving and comfort. With the continuous maturity and application expansion of this technology, we have reason to believe that the future digital world will be more colorful due to full flip-chip COB, and user experience will also reach a new height.