Product
For a long time, DIP and SMD LED screen packaging technologies have occupied the mainstream of the market. In the era of rapid expansion of LED displays, these two packaging technologies have been highly recognized and accepted by the market with their respective advantages. However, both DIP and SMD have their own problems that are difficult to overcome, such as the large spacing of DIP or the dead light rate of SMD.
With the R&D breakthroughs of domestic manufacturers, COB packaging technology has been introduced to the market. COB is a packaging technology that fixes LED light-emitting chips on a PCB substrate and then attaches glue to the whole. It has the characteristics of moisture-proof, anti-static and anti-collision, and the dead light phenomenon is greatly reduced. It is a suitable technical route for the mini era.
What are the advantages and characteristics of COB packaging technology?
1. Ultra-thin and light: According to the actual needs of customers, PCB boards with thicknesses from 0.4-1.2mm can be used to reduce the weight to 1/3 of the original traditional products, which can significantly reduce structural, transportation and engineering costs for customers.
2. Anti-collision and compression resistance: COB products directly encapsulate the LED chip in the concave position of the PCB board, and then encapsulate and solidify it with epoxy resin glue. The surface of the light spot is raised into a raised surface, which is smooth and hard, impact-resistant and wear-resistant. .
3. Strong heat dissipation ability: COB products encapsulate the lamp on the PCB board, and quickly transfer the heat of the wick through the copper on the PCB board. Moreover, the thickness of the copper foil of the PCB board has strict process requirements, plus the immersion gold process , will hardly cause serious light attenuation. Therefore, the lamp rarely dies and the life span is greatly extended.
4. Wear-resistant and easy to clean: The surface of the screen is smooth and hard, impact-resistant and wear-resistant. If there are bad pixels, they can be repaired point by point. If there is any dust, it can be cleaned with water or cloth.
5. Excellent all-weather characteristics: It adopts triple protection treatment, with outstanding waterproof, moisture, corrosion, dust, static electricity, oxidation, and ultraviolet effects; it meets all-weather working conditions and can still be used normally in a temperature difference environment of minus 30 degrees to plus 80 degrees.
Practical application of COB products; this technology is applied to C-Pad-c, which is a small pitch product of P0.78-P1.87.
C-Pad-c adopts magnetic module design and can be installed against the wall. Each module supports front maintenance, saving space and ensuring worry-free operation of large screens. The COB module has high stability and can greatly reduce the number of lamp beads or screen bodies. Received external aggression.
C-Pad-c has a point-by-point correction function to ensure the consistency of the display. High brush, high gray and high contrast make the display effect impeccable. This product is widely used in the following fields.
The emergence of COB technology has greatly promoted the progress of LED displays. Chip Optoelectronics has the ability to independently produce COB products and has currently launched a variety of COB products to the market.