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The principle of high-power COB heat dissipation mainly depends on the design of its packaging structure and the selection of materials. COB (Chip on Board) technology integrates LED chips directly on PCB boards, reducing the packaging level, thereby shortening the heat conduction path and improving the heat dissipation efficiency. Specifically, the heat of COB packaged chips is mainly transferred through the following ways:
Heat conduction path: The heat of COB packaged chips is mainly transferred to the heat sink through the metal substrate. Due to the large contact area between the chip and the metal substrate in the COB packaging structure, the heat can be quickly transferred to the metal substrate and then dissipated to the environment through the heat sink.
Material selection: In COB packaging, the selection of metal substrate is crucial to the heat dissipation effect. Commonly used metal substrate materials include copper, aluminum, aluminum oxide and aluminum nitride. Considering the cost, heat dissipation capacity and corrosion resistance, aluminum is the most commonly used metal substrate material.
Heat dissipation design: In order to further improve the heat dissipation effect, external heat sinks such as sunflower-shaped and wing-shaped heat sinks can be used. Thermal analysis through finite element analysis software such as ANSYS Workbench can optimize the design of the heat sink and reduce the chip temperature.
Thermal characteristic test: Use T3Ster semiconductor thermal characteristic tester to test the thermal resistance of COB-LED devices, and use the relationship between thermal resistance and thermal conductivity to obtain the material parameters of each part of the device. By combining experiments and simulations, efficient heat sinks can be designed more accurately.
Heat dissipation solution: In order to further reduce the temperature, semiconductor cooling sheets can be used to neutralize the heat emitted by the light-emitting board. This method can control the temperature of COB-type high-power LEDs below 50°C and extend their service life.
In summary, the heat dissipation principle of high-power COB is mainly to optimize the packaging structure and material selection, and use external heat sinks to improve the heat dissipation efficiency to ensure the stable operation of LEDs in high temperature environments.