Product
Since the LED small pitch of SMD package is reduced to 1.00mm, it faces the technical bottleneck of further miniaturization. This problem limits its further development in the field of ultra-high density display. In this context, COB packaged LED display screens came into being, gradually entered the public eye and emerged. This innovative packaging technology breaks through the multiple limitations of traditional SMD packaging in terms of size, heat dissipation and protection, and brings a revolutionary breakthrough to the LED display industry. By adopting COB packaging technology, LED display screens not only achieve smaller pixel pitches, but also improve overall reliability and durability, bringing display technology to a new height.
The emergence of COB LED display screens not only injects new vitality into the market, provides more diverse choices, but also brings users an unprecedented visual feast. With its excellent color expression, high contrast and delicate picture texture, COB LED display screens can easily cope with various complex scenes, whether it is commercial display, public information release or high-end conference room application, it can show excellent display effects. In addition, the advantages of COB packaging technology such as low power consumption and long life also save users a lot of operating costs and maintenance time, further improving user experience.
COB LED display has the following features:
Ultra-small pitch: COB packaging makes the unit display pixel more, the picture display is fuller, and the color is more delicate. This means that within the same screen area, the COB display can present more details and richer color levels, bringing users a more realistic visual experience.
Smooth screen: Unlike SMD packaging, COB packaging directly encapsulates the light-emitting chip onto the PCB board and cures it with epoxy resin glue, so the screen surface is very smooth and has no bumps. This smooth screen not only improves the appearance texture of the product, but also makes cleaning and maintenance easier and more convenient.
Strong protection: Epoxy resin glue curing makes the COB display screen not easy to be damaged during transportation, installation and disassembly, and the product is guaranteed from factory to use and later maintenance. This strong protection enables the COB display screen to maintain stable performance in various harsh environments and extend its service life.
"Surface" light source luminescence: effectively suppresses moiré, high filling factor optical design reduces light refraction, concentrates colors, and has better light perception. This unique luminescence method makes the COB display screen clearer and more natural when displaying images, reducing visual fatigue.
Good heat dissipation performance: Heat is dissipated directly through the PCB board without accumulation, which extends the service life of the product and ensures safe use. Good heat dissipation performance is an important guarantee for the stability of electronic products, especially for LED displays that need to run for a long time.
Although the overall performance of COB LED displays is superior, there are also some shortcomings:
When the dot pitch is below 1.2mm, the screen ink color consistency is not good. This may affect the uniformity of the display effect, especially in low grayscale and dark performance.
The COB packaging process requires high R&D costs and technical perfection. This increases the manufacturing cost of the product and also puts higher requirements on the technical strength of the enterprise.
The different packaging methods mean that if LED display companies want to invest in COB displays, the original production lines need to be adjusted or replaced. This is a considerable investment for the company, and it also takes a certain amount of time to complete the transformation.