What are the components of chip on board led?

The product structure of COB LED usually includes the following components:

Substrate: This is the base of the COB LED, usually made of ceramic or metal. It provides a stable surface for mounting LED chips and also helps in heat dissipation.

LED Chips: These are individual LED chips mounted on a substrate. COB LEDs can have multiple LED chips, sometimes as many as hundreds or even thousands, depending on the size of the LED and the application.

Bond Wires: These are the thin wires that connect the LED chip to the substrate and to each other. They are usually made of gold or aluminum and are used to ensure the electrical connection between the LED chips.

Phosphor layer: This is a layer of phosphor material that is coated on top of the LED chip to convert the blue light emitted by the chip into white light. Phosphor layers can be tailored to produce different color temperatures and color rendering characteristics.

Epoxy: This is a protective layer that is applied to the LED chips and bond wires to protect them from damage and to help improve thermal performance.

Contacts: These are the electrical contacts used to connect the COB LEDs to a power source. These are usually located on the side or bottom of the substrate and can be customized to fit different types of connectors or sockets.

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