What is the difference between COB Chip and SME

The difference between COB and SMD:

SMD stands for Surface Mount Device while COB stands for Chip on Board, both SMD and COB refer to different types of electronic components used in electronic equipment

SMD refers to an electronic component that can be mounted on the surface of a printed circuit board (PCB). Such components are usually small and flat, and are soldered to the surface of the PCB using a reflow soldering process. Examples of SMD components include resistors, capacitors, diodes and transistor

COB refers to a packaging technology for integrated circuits (ICs). In COB packaging, the IC is mounted directly on the surface of the PCB with its active surface facing up, and then the IC is wire bonded to the PCB and coated on the top. A layer of protective epoxy is applied to protect the IC and bonding wires, and COB packages are often used for small, low-power ICs such as sensors, microcontrollers, and LED drivers.

To sum up, SMD refers to a component mounting technology, and COB refers to a packaging technology.

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