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Is there any difference between COB package module and SM package module? SMD package module has always been the module used in traditional LED display screens, but with the introduction of COB package technology, it has occupied more and more markets with its excellent performance. Now COB package module has also been launched, and the price advantage of SMD is almost gone. Today we will compare the two modules for you so that customers can make a suitable choice.
COB package module and SI package module are generally compared from three aspects, namely technology comparison, performance comparison and application.
1. Technology comparison
The packaging technology used by COB package module is a packaging method that directly adheres the LED chip to the PCB substrate and realizes electrical connection through conductive glue or welding wire. This technology simplifies the packaging process, reduces the production steps, helps to reduce costs and improve production efficiency. The SM packaging technology is to encapsulate the LED chip in a small package body, and then solder the package body to the PCB board through the SMT process.
2. Performance comparison
COB package module has obvious advantages in performance.
First, the C0B package module chip is directly packaged on the PCB board by sonic welding, and the surface is encapsulated with epoxy resin, which is smooth and flat, and has "ten protection" functions, including waterproof, moisture-proof, impact-proof, bump-proof, anti-static, salt spray-proof, anti-oxidation, anti-blue light, and anti-vibration. The S package module uses solder to stick the LED lamp tube on the lamp board. The surface is a raised structure. Each lamp has only 4 very small solder pins. It is easy to fall off due to squeezing, touching, etc., and it has no moisture-proof and waterproof functions.
Secondly, the heat dissipation performance of the COB package module is better. Since the C0B package module directly installs the LED chip on the heat dissipation substrate, the heat can be more effectively conducted to the substrate, thereby improving the heat dissipation performance. The S package module mainly dissipates heat through colloid and four pads, and the heat dissipation area is small, which is easy to cause heat concentration, affecting the service life and quality of the display.
P1.25COB National Installation Common Light Technology Matt Sleep Light Waterproof
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And, the failure rate of the COB package module is lower. We all know that over time, bad pixels will accumulate and need to be repaired, but C08 packaging does not have processes such as lamp bead packaging, reflow soldering, and patching, which greatly improves the stability of the LED display. Therefore, the bad lamp rate of C0B is less than one-tenth of SI, and almost no maintenance is required.
Finally, the C0B module structure has better adaptability. SM is uncomfortable for the eyes when viewed for a long time or at close range, and it is easy to produce glare and stinging. C0B uses matte coating to improve contrast, reduce glare and glare, and is not easy to produce visual fatigue.
3. Application comparison
COB packaging modules are mainly used in LED display screens with a dot pitch below P1.5. This comparison is used in higher-end conference rooms, exhibition halls and other display places, while S packaging modules can be used in the range of P0.9 to P20, as long as they are used in display screens with a dot pitch specification of more than P1.8.
To sum up, compared with the two, the COB packaging module is more advanced in technology, has better ten-proof function and heat dissipation performance, as well as lower dead light rate and better viewing experience, but it still has a place in the market. However, with the popularity of COB and the gradual decline in prices, customers will still choose the COB packaging module with friendly price and superior performance.
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