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The main principle of high-power LED heat dissipation technology is to dissipate the heat generated by the LED during operation in a timely manner through various methods to maintain its normal operating temperature and prevent performance degradation or damage caused by overheating.
The main principle of high-power LED heat dissipation technology is to dissipate the heat generated by the LED during operation in a timely manner through various methods to maintain its normal operating temperature and prevent performance degradation or damage caused by overheating.
Working principle and thermal effect of high-power LEDs
The working principle of high-power LEDs is to convert electrical energy into light energy, but in this process, most of the input power will be converted into heat energy. The PN junction of the LED will generate a lot of heat when working. If it cannot be dissipated in time, the heat will be concentrated in the PN junction, thereby reducing the service life of the LED, and even burning in severe cases.
Key parameters and common technologies of heat dissipation technology Natural convection heat dissipation: By designing a heat dissipation structure, natural convection of air is used to dissipate heat. For example, PetroSki has developed a new heat sink structure based on natural convection, which adopts a cylindrical structure and is covered with longitudinally distributed fins to achieve isotropic heat dissipation effect. Forced convection heat dissipation: Force air flow through equipment such as fans or pumps to increase heat dissipation efficiency. For example, S.W.Chau proposed a cooling device using the electrohydrodynamic method (EHD), which uses ion wind for forced convection heat dissipation, and its heat transfer coefficient is 7 times that of natural convection.
Thermoelectric cooling: By integrating silicon-based thermoelectric coolers with LEDs, active cooling is performed using the thermoelectric effect. For example, Liu Chunkai et al. integrated silicon-based thermoelectric coolers with flip-chip high-power LEDs, effectively reducing the temperature of the Pn junction and improving the light output efficiency.
Specific applications and effects of heat dissipation technology
Natural convection heat dissipation: Suitable for low-power, low-cost LED applications, by optimizing the heat dissipation structure design, using the natural flow of air to dissipate heat.
Forced convection heat dissipation: Suitable for LED applications with high power consumption and high efficiency requirements, and forced air flow is used to increase the heat dissipation effect.
Thermoelectric cooling: Suitable for application scenarios with extremely high temperature control requirements, and active cooling is used to maintain the stable operating temperature of the LED.
Future development trends and research directions
The future development directions of high-power LED heat dissipation technology include:
Optimize chip epitaxial structure: Reduce the heat generated by non-radiative recombination by designing and optimizing chip epitaxial structure.
Improve packaging materials: Use packaging materials with high thermal conductivity, such as aluminum-based printed circuit boards (MCPCBs) and composite metal substrates to accelerate heat transfer.
Study new heat dissipation materials: Explore new high thermal conductivity materials, such as boron nitride, to improve heat dissipation efficiency.
In summary, high-power LED heat dissipation technology effectively solves the heat problem generated by LEDs during operation through a variety of methods and technical means, ensuring its stable and efficient operation.