What are the substrates of COB LEDs?

COB LED Substrate Type:

COB (chip-on-board) LEDs are designed to be mounted directly on a substrate that acts as a carrier for the LED chip, providing electrical connections and thermal management. There are various types of substrates available for COB LEDs, including:

Ceramic Substrates: Ceramic substrates are often used in COB LEDs because they have good thermal conductivity and can dissipate heat effectively. They are also highly durable and can withstand high temperatures.

Metal Core Printed Circuit Boards (MCPCBs): Metal core printed circuit boards are made of a metal core layer (usually aluminum) sandwiched between layers of thermal insulation and copper. They are very efficient at dissipating heat and are often used in high power COB LEDs.

Flexible Printed Circuit Boards (FPCB): FPCBs are thin, light, and flexible, making them ideal for applications where space is limited. They are also highly resistant to vibration and shock.

FR4 printed circuit boards: FR4 printed circuit boards are made of glass fiber reinforced epoxy laminates and are a popular choice for low power COB LEDs. They are very cost-effective and easy to manufacture.

Silicon substrate: The silicon substrate is very durable and can withstand high temperatures, making it ideal for high-power COB LEDs. They are also highly resistant to mechanical stress and can be produced in large quantities at relatively low cost.

The choice of substrate depends on the specific requirements of the application, including required power output, thermal management, size and cost.

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